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KSW Microtec to present prelaminates at ID World
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Electronics Talk
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November 03, 2009
KSW Microtec will present a new generation of prelaminates for e-government, e-payment and access applications at ID World International Congress 2009 in Milan on 3-5 November. Thinlam, with a thickness down to 280um, enables card manufacturers to produce high-frequency and ultra-high-frequency radi...
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