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Applied Micro ships microserver chips in challenge to Intel   - 2 Hours ago
Applied Micro Circuits has begun shipping a new kind of low-power server chip that might challenge heavyweight Intel in cutting-edge data centers. SAN FRANCISCO, July 29 The Sunnyvale, California, company
all 1 news articles >>
  
    



VIETNAM PRESS-Intel to make 80 pct of global computer chips in Vietnam - Tuoi Tre   - 45 Minutes ago
Intel's factory in Vietnam will produce 80 percent of the firm's computer chips globally by July 2015, according to an Intel Products Vietnam official, the Tuoi Tre (Youth) newspaper reports. Intel
  
    




Accretive Capital Partners Reiterates Its Demand for Immediate Dutch Auction Tender   - 3 Hours ago
LIGHTNING RELEASES (7/29/2014) - An Open Letter to the Board of Directors of Actions Semiconductor Co., Ltd. July 29, 2014 Mr. Hsiang-Wei Lee Chairman of the Board Actions Semiconductor Co.,
  
    



AMD's ARM: A Smart Move?   - 3 Hours ago
Advanced Micro Devices   ( NYSE: AMD     ) has for long lagged Intel ( NASDAQ: INTC     ) in the high-performance computing space. Its limited grab over the retail and enterprise chip segment has hampered
  
    



Applied Micro Circuits begins shipping microserver chips; may challenge Intel   - 66 Minutes ago
SAN FRANCISCO: has begun shipping a new kind of low-power server chip that might challenge heavyweight Intel in cutting-edge data centers. The Sunnyvale, California, company disappointed Wall Street
  
    



7/30/2014: Business: Mansion House makers TI eyeing ` 825-crore stake sale   - 92 Minutes ago
MUMBAI: Tilaknagar Industries (TI), the maker of Mansion House Brandy, is planning to sell stakes worth around ` 825 crore to pare its debt, according to a top company official. The company, which is
all 1 news articles >>
  
    


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NVIDIA releases its new GeForce 340.52 WHQL drivers   - 52 Minutes ago
NVIDIA launches its kick ass new Shield Tablet today, and alongside it the company has launched its new GeForce 340.52 WHQL drivers. The biggest feature of the new GeForce 340.52 WHQL drivers is Shield
  
    



AMD Releases FreeSync Information as a FAQ   - 111 Minutes ago
Dynamic refresh rates have two main purposes: save power by only forcing the monitor to refresh when a new frame is available, and increase animation smoothness by synchronizing to draw rates (rather
  
    



Microsoft and Intel Release ‘Sharks Cove’, a Windows-based Microcomputer   - 114 Minutes ago
0 Flares Twitter 0 Facebook 0 Google+ 0 LinkedIn 0 StumbleUpon 0 Pin It Share 0 Reddit 0 Email -- Filament.io
  
    


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ARM Cement CEO Pradeep Paunrana is the new KAM Chairman   - 2 Hours ago
AM Cement’s CEO, Mr. Pradeep Paunrana is the new chairman of the Kenya Association of Manufacturers(KAM) board. The change follows expiry of Mr. Polycarp Igathe’s two-year tenure at the helm of the industrialists’
  
    



Axiomtek’s high-performance 4th Generation Intel® Core™ Mini ITX Motherboard – MANO881   - 3 Hours ago
Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, is pleased to announce the arrival of the MANO881,
  
    



ANALOG DEVICES' BOB ADAMS AWARDED 2015 IEEE DONALD O. PEDERSON AWARD IN SOLID-STATE   - 3 Hours ago
Norwood, MA (07/29/2014) - , Inc. (NASDAQ: ADI) Technology Fellow Bob Adams, a leader in the development of groundbreaking multi-bit sigma-delta data converters, has been selected to receive the 2015
all 1 news articles >>
  
    


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Driving method of semiconductor device   - 54 Minutes ago
The semiconductor device includes a transistor and a capacitor element which is electrically connected to a gate of the transistor. Charge held in the capacitor element according to total voltage of voltage
  
    



Seoul Semiconductor Introduces a New Acrich-based Module for Omnidirectional Lamps   - 60 Minutes ago
This article was originally distributed via PRWeb. PRWeb, WorldNow and this Site make no warranties or representations in connection therewith. SOURCE: Seoul Semiconductor announces the release of
  
    



Semiconductor memory devices having strapping contacts   - 66 Minutes ago
are provided, the devices include cell regions and strapping regions between adjacent cell regions in a first direction. Active patterns, extending in the first direction throughout the cell regions and
  
    



Thin-film semiconductor device for display apparatus, method for manufacturing thin-film   - 66 Minutes ago
A thin-film semiconductor device for a display apparatus according to the present disclosure includes: a gate electrode above a substrate; a gate insulating film above the gate electrode; a semiconductor
  
    



Compound semiconductor device and manufacturing therefor   - 66 Minutes ago
A compound semiconductor device includes a compound semiconductor laminated structure, a passivation film formed on the compound semiconductor laminated structure and having a through-hole, and a gate
  
    



GaN film structure, method of fabricating the same, and semiconductor device including   - 66 Minutes ago
A method of fabricating a gallium nitride (GaN) thin layer, by which a high-quality GaN layer may be grown on a large-area substrate using an electrode layer suspended above a substrate, a GaN film structure
  
    



Semiconductor light emitting element having a plurality of substrate cutouts and   - 66 Minutes ago
In a semiconductor light emitting element (1) having a sapphire substrate (100), and lower (210) and upper (220) semiconductor layers laminated on the sapphire substrate, the substrate includes a substrate
  
    



Semiconductor light emitting device packages and methods   - 66 Minutes ago
A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset
  
    



Semiconductor laser chip package with encapsulated recess molded on substrate and   - 66 Minutes ago
A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric
  
    



Semiconductor devices, assemblies and constructions   - 66 Minutes ago
Embodiments disclosed herein include methods in which a pair of openings are formed into semiconductor material, with the openings being spaced from one another by a segment of the semiconductor material.
  
    



Power semiconductor device including a double metal contact   - 66 Minutes ago
A power semiconductor device that includes a stack of a thin metal layer and a thick metal layer over the active region thereof, and a method for the fabrication thereof.
  
    



Semiconductor device including gate and conductor electrodes   - 66 Minutes ago
An object is to provide a field effect transistor (FET) having a conductor-semiconductor junction, which has excellent characteristics, which can be manufactured through an easy process, or which enables
  
    



Semiconductor package having an interposer configured for magnetic signaling   - 66 Minutes ago
There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active
  
    
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